Abstract
ABSTRACTCopper films sputter deposited on mechanically polished (optical finish) and on annealed substrates were laser-irradiated at various energy densities. The effect of the substrate condition on both the evaporation threshold and the morphology of the laser-irradiated metallic films was investigated. The energy density threshold for laser-induced evaporation of the copper films was studied using energy dispersive x-ray spectroscopy (EDS) in a scanning electron microscope (SEM). It was found that for annealed substrates the energy density threshold decreases relative to the threshold for the as-polished condition. These results are compared with predictions of a mathematical model that assumes that the near surface region of the as-polished ceramic is a highly damaged region and, thus, constitutes a thermal barrier. The film remains intact and with almost no change in morphology after laser irradiation at energy densities lower than 0.80 J/cm2 if the substrate has been previously annealed. On the other hand, copper films deposited on as-polished substrates break up during laser processing forming copper islands.
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