Excellent Thermally Conducting Ni Plating Graphite Nanoplatelets/Poly(phenylene sulfone) Composites for High-Performance Electromagnetic Interference Shielding Effectiveness.

Zhang Chen,Ting Yang,Lin Cheng,Jianxin Mu

doi:10.3390/polym13203493

Abstract

First, nickel particles were deposited on the surface of graphite nanoplatelets to fabricate highly conductive GnPs@Ni core-shell structure hybrid fillers via electroplating. The modified GnPs were blended with polyphenylene sulfone via the solution blending method, followed by the hot-pressing method to achieve high thermally conducting GnPs@Ni/PPSU composites for high performance electromagnetic interference effectiveness. The results showed that in-plane and through-plane thermal conductivity of the composite at the 40 wt% filler loading could reach 2.6 Wm−1K−1 and 3.7 Wm−1K−1, respectively, which were 9.4 and 20 times higher than that of pure PPSU resin. The orientation degree of fillers was discussed by XRD and SEM. Then, heat conduction data were fitted and analyzed by the Agari model, and the heat conduction mechanism was further explored. The testing results also demonstrated that the material exhibited good conductivity, electromagnetic shielding effectiveness and superior thermal stability. Overall, the GnPs@Ni/PPSU composites had high thermal conductivity and were effective electromagnetic shielding materials at high temperatures.

Highlights

With the advent of the fifth-generation mobile communication and artificial intelligence technology, electronic devices are stepping towards miniaturization and high integration, which makes the power consumption of electronic products increase and the heat dissipation difficult, seriously limiting the development of the generation of novel electronic components [1,2,3]
Incorporating thermal conductive fillers, such as metal powders [5], carbon nanotubes [6], graphite [7], graphene [8] and boron nitride [9] into polymer matrix to fabricate high λ polymeric composites are widely used in the field of industry, microelectronics, energy, aerospace and so on due to their light weight, chemical corrosion resistance, impact resistance and easy processing [10,11,12]
In light of the findings advanced by our previous research team members [18], the surface modification of nano graphite sheet is carried out by chemical plating technology, and nickel nano particles are deposited on the surface of graphite nanoplatelets to prepare the electrical and thermal conductive fillers GnPs@Ni with core-shell structure

Summary

Introduction

With the advent of the fifth-generation mobile communication and artificial intelligence technology, electronic devices are stepping towards miniaturization and high integration, which makes the power consumption of electronic products increase and the heat dissipation difficult, seriously limiting the development of the generation of novel electronic components [1,2,3]. Incorporating thermal conductive fillers, such as metal powders [5], carbon nanotubes [6], graphite [7], graphene [8] and boron nitride [9] into polymer matrix to fabricate high λ polymeric composites are widely used in the field of industry, microelectronics, energy, aerospace and so on due to their light weight, chemical corrosion resistance, impact resistance and easy processing [10,11,12]. In light of the findings advanced by our previous research team members [18], the surface modification of nano graphite sheet is carried out by chemical plating technology, and nickel nano particles are deposited on the surface of graphite nanoplatelets to prepare the electrical and thermal conductive fillers GnPs@Ni with core-shell structure. We hope that by adding high thermal conductivity filler, the polymer will have good thermal conductivity and electromagnetic shielding performance, so as to expand the application of polymers in the field of electronic communication and promote the realization of the goal of replacing steel with plastic

Materials

Characterization

Results and Discussion

Conclusions