Abstract
The electrodeposition of copper on a Pt(111) electrode in a 0.5M H 2SO 4 solution was studied by means of voltammetry, low energy electron diffraction and ex-situ infrared reflection absorption spectroscopy. At any potential between 0.25 and 0.85 V versus the standard hydrogen electrode, the same diffraction pattern of (√3 × √3)-R30° was observed due to a top-layer structure of bisulfate or sulfate before and after the copper deposition. The voltammetric peak at 0.59 V was due to copper adsorption while that at 0.49 V originated from a bisulfate to sulfate conversion on copper during a cathodic sweep. At an electrode potential for underpotential deposition of copper, a bisulfate becomes weakly bound to platinum atoms allowing copper deposition; simultaneous adsorption of bisulfate on the copper layer prohibits further copper deposition.
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