Abstract
The as-cast AuSn20 eutectic alloys prepared by four different solidification pathways have been investigated in terms of the microstructure and the high-temperature compressive behaviors. The primary phases appeared in the four alloys are very sensitive to the cooling rate, which decrease in the size and the volume fraction as the cooling rate increases. The morphologies of the primary ζ′-Au5Sn phase are in dendritic at low cooling rate and change to rosette-like at high cooling rate. When the cooling rate is about 3.5 × 104 K/min, the primary ζ′-Au5Sn can be suppressed but small δ-AuSn particles appear instead as the primary phase. The compressive behaviors at 220°C exhibit a low yielding stress and a long stress platform for the alloy prepared by injection casting with a copper crucible, which indicates an advantageous processing route for the production of the AuSn20 strips or foils.
Highlights
Au-20 wt.% Sn eutectic solder alloy is extensively used in high power electronics andQ
It is well known that the miniaturization of microelectronic packages requires the bulk AuSn20 solder alloy to be very thin
The primary phase is very sensitive to the cooling rate
Summary
Au-20 wt.% Sn eutectic solder alloy (denoted as AuSn20 hereafter) is extensively used in high power electronics andQ. Au-20 wt.% Sn eutectic solder alloy (denoted as AuSn20 hereafter) is extensively used in high power electronics and. It is expected that rapid solidification [14, 15] will result in refined microstructure, extended solubility, reduced microsegregation, and forming metastable phases
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