Abstract

The as-cast AuSn20 eutectic alloys prepared by four different solidification pathways have been investigated in terms of the microstructure and the high-temperature compressive behaviors. The primary phases appeared in the four alloys are very sensitive to the cooling rate, which decrease in the size and the volume fraction as the cooling rate increases. The morphologies of the primary ζ′-Au5Sn phase are in dendritic at low cooling rate and change to rosette-like at high cooling rate. When the cooling rate is about 3.5 × 104 K/min, the primary ζ′-Au5Sn can be suppressed but small δ-AuSn particles appear instead as the primary phase. The compressive behaviors at 220°C exhibit a low yielding stress and a long stress platform for the alloy prepared by injection casting with a copper crucible, which indicates an advantageous processing route for the production of the AuSn20 strips or foils.

Highlights

  • Au-20 wt.% Sn eutectic solder alloy is extensively used in high power electronics andQ

  • It is well known that the miniaturization of microelectronic packages requires the bulk AuSn20 solder alloy to be very thin

  • The primary phase is very sensitive to the cooling rate

Read more

Summary

Introduction

Au-20 wt.% Sn eutectic solder alloy (denoted as AuSn20 hereafter) is extensively used in high power electronics andQ. Au-20 wt.% Sn eutectic solder alloy (denoted as AuSn20 hereafter) is extensively used in high power electronics and. It is expected that rapid solidification [14, 15] will result in refined microstructure, extended solubility, reduced microsegregation, and forming metastable phases

Results
Discussion
Conclusion

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.