Abstract
The high dense interconnect (HDI) organic chip packaging technology has made rapid development advancements in the last few years. Due to the dense wiring structures in the build up layers and the recently introduced fine line core with micro vias, high signal input/output (I/O) applications and dense chip area array footprints can be supported. These technology improvements support specific new dense chip applications. In this paper the electrical characteristics and the evolution of this packaging technology is described. The electrical description is especially focussed on material characteristics and the signal integrity including cross talk. In addition the impact on high speed data transmission and the performance differences between single-chip module (SCM) and multichip modules (MCM) are discussed. Also the power integrity is described on the basis of the results of a mid frequency power noise analysis.
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