Abstract
In this study, influence of magnetron sputtering on indium gallium zinc oxide (IGZO) ceramic target was studied to improve its performance and utilization. Results indicated that state of the target such as target grain uniformity, micro defects, C element pollution, and secondary phase showed significant influence on magnetron sputtering process. Atoms located in small grains were easily bombarded out of IGZO target, and grains with slow sputtering rate protruded from target surface. Porous microstructure of IGZO ceramic created abnormal electric field of the target during sputtering, resulting in the poisoning of target. Moreover, more indium atoms were sputtered from the target, and the proportion of In after sputtering decreased by 0.62–0.97%. The difference in sputtering rates between secondary phase and main phase led to the formation of IGZO cladding layer with poor conductivity under the combined action of sputtering and re-sputtering. In sum, these findings may provide strong guidance for further improvement and performance enhancement of IGZO sputtering target.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
