Evolution of Cube Texture in Cu-45at.%Ni Alloy Substrates for YBCO Coated Conductors

Abstract

The cube texture evolution during annealing of the heavy cold-rolled Cu-45at.%Ni alloy tapes were investigated by XRD and electron back scattering diffraction techniques. The results indicated that the fraction of Copper-type rolling texture was slightly strengthened during recovery, and then strongly reduced during recrystallization. The cube texture was formed by consuming the rolling texture components during recrystallization process, and the S, Copper and Brass orientations were consumed together via cube grain growth. A strong cube-textured Cu-45at.%Ni alloy substrate with the cube texture fraction of 98.6 % (< 10°) was obtained after annealing at 1000 oC for 1 h.