Abstract
We report excellent high-temperature (300 °C) wear resistance of copper mold-cast Al80Cu15Ni5 and Al75Cu15Ni10 alloys. The evolution of a novel bimodal microstructure consisting of α-Al, eutectic α-Al + Al2Cu, and a vacancy ordered phase (Al3Ni2 type) restricts severe adhesive and abrasive wear at high temperature. Particularly, the Al75Cu15Ni10 alloy shows a low wear rate at 300 °C. In-depth microstructural characterization of the as-cast alloys and the worn samples elucidate the wear mechanism.
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