Abstract
The relation between cooling rate and morphology of Ag <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> Sn IMCs was investigated in this study. The morphology of Ag <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> Sn intermetallic compounds of eutectic Sn-3.5Ag solder was investigated after solidification at different cooling rates. As the nucleation time of Ag <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> Sn depended on cooling rate, the morphology and size of Ag <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> Sn compounds were affected by cooling rate. The three types of Ag <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> Sn compound during different cooling rate solidification were found to be particle-like, needle-like, and plate-like in Sn-3.5Ag solder. The results show that as the cooling rate decreases, the morphology of Ag <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> Sn formed in Sn-3.5Ag solder transforms progressively from particle-like to plate-like.
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