Evidence of stress dependence in SiO2/Si3N4 encapsulation-based layer disordering of GaAs/AlGaAs quantum well heterostructures

Abstract

Spatial selectivity of layer disordering induced in GaAs/AlGaAs quantum well heterostructures using SiO2 and Si3N4 capping and annealing was investigated using low temperature photoluminescence in conjunction with cross-sectional transmission electron microscopy. Comparative study reveals opposite behaviors for patterned Si3N4 covered with SiO2 and patterned SiO2 covered with Si3N4. In the former, layer disordering occurs in the regions located under the SiO2 strips and in the latter, layer disordering surprisingly occurs under the Si3N4 strips while it is inhibited in the SiO2-capped areas. These results are in agreement with a proposed interdiffusion model based on the effect on Ga vacancy diffusion of the stress distribution generated in the heterostructure during annealing by the capping layers. This work clearly demonstrates that the diffusion of point defects, such as the Ga vacancies, which are responsible for the layer disordering, can be piloted by the stress field imposed to the semiconductor and opens new perspectives for defect engineering.