Evaluations of 300 mm Si wafer performances for giga ULSI device processes

Abstract

Selete evaluated more than 130 tools for 300-mm wafer processes from FEOL to BEOL since November 1996. According to Selete prediction, the middle of the year 2001 is the launch time for the large-scale volume production of devices using 300-mm wafers. Previous to the evaluation of 300-mm tools and wafers, Selete has made specifications of tools and wafers, which meet the requirements for fabrication of 0.18 μm device. Based on these specifications Selete carried out evaluations on basic process performance, productivity, and electrical properties of wafers. Process tools are divided into 23 categories. Basic strategy is to evaluate at least two tools for each category. Selete evaluated eight Si supplier’s wafers, including polished and epitaxial wafers, as of March 2000. The evaluation will be continued based on 0.13 μm device target rules until March 2003. This paper describes Selete’s activities on equipment and materials evaluation, and provides an overview of the latest outcome.