Abstract
Diffusion bonding of TiAl alloys and Ti3SiC2 ceramics were carried out in a vacuum atmosphere. The microstructures and mechanical properties of the bonded joints were investigated. Results showed that three coherent intermetallic layers formed in the TiAl/Ti3SiC2 joints during bonding process. The compound layer adjacent to Ti3SiC2 substrate was indicated to be Ti5Si3, in which brittle fracture of the joints took place during shear strength test. The properties of diffusion bonded joints were greatly improved attributed to the formation of a good transition in the joint as well as the relief of the residual stress when using Ni foil as interlayer. Formation mechanisms of the compound layers during bonding process were discussed. Shear test results showed that the maximum shear strength reached 52.3MPa. Corresponding fractograph indicated that the crack mainly propagated along Ti3SiC2 substrate adjacent to the bonding zone, accompanied with an intergranular and transgranular fracture mode.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
