Evaluation of Various Baking Methods for Polished Wheat Flours

Abstract

ABSTRACTFlour qualities of polished wheat flours of three fractions, C‐1 (100–90%), C‐5 (60–50%), and C‐8 (30–0%), obtained from hard‐type wheat grain were used for the evaluation of four kinds of baking methods: optimized straight (OSM), long fermentation (LFM), sponge‐dough (SDM) and no‐time (NTM) methods. The dough stability of C‐5 in farinograph mixing was excellent and the maturity of polished flour doughs during storage in extensigraph was more improved than those of the commercial wheat flour (CW). There were no significant differences in the viscoelastic properties of CW dough after mixing, regardless of the baking method, while those of polished flour doughs were changed by the baking method; this tendency became clear after fermentation. The polished flours could make a better gluten structure in the dough samples after mixing or fermentation using LFM and SDM, as compared with other baking methods. Baking qualities such as specific volume and storage properties of breads from all polished flours made with SDM increased more than with other methods. In addition, viscoelastic properties of C‐5 and C‐8 doughs fermented by SDM were similar to those of CW, and the C‐5 breadcrumb showed softness similar to that of the CW. Also, SDM could make C‐5 bread with significantly higher elasticity and cohesiveness after storage for five days when compared with CW bread. Therefore, SDM with long fermentation, as compared with other baking methods, was considered suitable for use with polished flours to give better effects on dough properties during fermentation, resulting in more favorable bread qualities.