Evaluation of tribo-mechanical measurements and thermal expansion of Cu-based nanocomposites reinforced by high strength hybrid ceramics

Abstract

It is known that Copper’s (Cu) electrical conductivity makes it a desirable material for use in industry. Due to poor properties such as hardness, thermal expansion, and corrosion resistance, its applications are limited. This manuscript solves these problems while maintaining no breakdown in electrical conductivity. In this study, high-strength ceramics (SiC nanoparticles and graphene nanosheets) were used as reinforcements in the manufacture of Cu-based hybrid nanocomposites using powder metallurgy technique. X-ray diffraction analysis (XRD) was used to investigate phase composition and crystal size of the milled powders. Transmission electron microscopy (TEM) and field emission scanning electron microscopy (FESEM), respectively examined the microstructure of the prepared powder powders and sintered nanocomposites. Then, various properties of the sintered samples are measured, including physical, electrical and thermal properties and wear resistance. The obtained XRD technique and TEM images showed decreases in the crystal and particle size of milled samples reaching up to 14.08 and 28.30 nm, respectively for the sample contained 8 vol. % SiC + 0.8 vol. % graphene (SG8). A surprising improvement in the mechanical properties of up to 809.15, 341.84 MPa and 336.56 GPa for microhardness, strength and longitudinal modulus for the sample containing the highest reinforcements, achieving an improvement of up to 122, 61.37 and 41 percent compared to the Cu matrix. Moreover, there was a noticeable improvement in the coefficient of thermal expansion (CTE) and wear rate values of the samples by increasing the percentages of hybrid reinforcements in the examined sintered nanocomposite samples. The Sample SG8 recorded the lowest value, decreasing by about 50.2 and 76.5% compared to the SG1 sample. Finally, adding reinforcements to the Cu matrix had a negative effect on the relative density and electrical conductivity, and the lowest values was 92.94% and8.59 × 106 S/m, respectively for the SG sample.