Abstract
Thermal shock resistance of silicon nitride was evaluated by a quenching test using precracked specimens and molten solder as a cooling medium. A thermal shock parameter, Rc (=ΔTc*⋅√C), which corresponds to fracture toughness and is obtained easily from a general quenching test has been defined. Here, C is the half length of a precrack and ΔTc* is the applied temperature difference when the first small propagation of the precrack is observed. As a result, it was confirmed that Rc is almost constant regardless of the crack length and temperature dependence of material properties. In addition, a critical temperature difference for an uncracked specimen was predicted from ΔTc* and C using an equivalent crack length of natural fracture origin. This numerical prediction was also applied to the estimation of the thermal shock resistance of other ceramics.
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