Evaluation of thermal mapping analysis technique for failure mechanism

Abstract

Fault isolation is a process for failure analysis laboratory to identify where the defect is and correlate it to the physical location. There are many different challenges to consider in localization techniques since there are multiples electrical faults with render multiple failure mechanisms. Basically, depending on the location of the physical defect, the faults mechanism will vary, as well as, the electrical consequences. There are different techniques to identify failure localizations. Selection of the localization technique depends on the fault electrical signatures - given that a defect can lead to multiple electrical consequences, depending on how it is stimulated (in this case recovery after mold compound removal). Thermal Imaging camera is a device that computes the heat generated/radiated off from the defective site and the infrared spectrums forming an image. The higher amount of radiation radiated, the higher the temperature would be. Thermal imaging device provides an image based on the heat generated from the objects which enables the analyst to pinpoint the fault location on the sample. The process is non-destructive. Fault localization can now be done thanks to electrical activation through packages. In this paper, one of the fault isolation techniques which is the thermal mapping analysis will be introduced and explained thru failure analysis process consecutively determining the defect site.