Abstract

ABSTRACT The slug flow in a superhydrophobic microchannel with a T-junction was studied computationally. The continuous phase passed through the main channel while the dispersed phase 1 1. was introduced through the side channel. The volume of fluid (VOF) was employed to track the interface to study the dynamics of slug flow. First, a mesh independence study was carried out to select the optimum mesh by comparison of CFD results with experimental data. The developed model of microchannel was used to study slug flow heat transfer enhancement for micro cooling of electronic chips. The constant heat flux was applied on the walls of the microchannels and the axial wall temperature profile was noted. Upon quantification of heat transfer augmentation in terms of wall temperature reduction, Nusselt number and heat transfer coefficient enhancement, it was noted that slug flow performed much better vis-à-vis single-phase flows at similar conditions.

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