Abstract
In recent years, moire interferometry method has been used extensively in the electronics industry to determine thermal strains caused by temperature changes in microelectronics devices. The size of a flip-chip package has getting smaller. To measure thermal deformations of these small flip-chips, instruments with much higher resolution are required. Many researchers have tried to achieve this resolution enhancement of moire interferometry by using a phase-shifting method. But the phase-shifting method has physical limitations. Fundamentally to get higher resolution, the laser source should be changed. In this article, we constructed a moire interferometry system by utilizing an ultraviolet laser (/spl lambda/=325nm). This UV system realizes higher resolution than He-Ne (/spl lambda/=633nm) system. And we apply this system to evaluate thermal deformation in flip-chip package.
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