Evaluation of the Patternability of Fibre-Based Materials with Converting Experiments

Abstract

Paperboard based packaging products are renewable alternatives for packages made traditionally from oil-based polymer materials and can be used for packaging of various products [1]. Embossing is used in packaging solutions to increase the functionality and appearance of the products. It can also be used to increase product safety by improving distinctiveness and identifiability of packages [2]. The aim of the study was to evaluate the patternability of various fibre-based materials. It was desired that the accuracy and details of the embossed pattern would be the same in all samples, regardless of their different material properties. The realization of this was evaluated by several analyses related to the performance of the materials in the embossing process. Eleven different sample materials were collected for the experiments so that the patternability could be studied extensively. The common denominator of the materials selected for testing was that they were all fibre-based paper and paperboard materials used in the packaging industry. Set of embossing tools were developed, and precision machined from brass, for the experiments. A laboratory scale mechanical embossing device was utilized in modification of sample surfaces to study patternability of selected fibre-based sample materials. The main variables in the forming experiments were pressing force and tool temperature. The samples were observed primarily visually - with the naked eye, with a scanning electron microscope and a 3D-profilometer which was used in the topography analysis of the achieved patterns. The results of the embossing test series confirmed that the height of the pattern increased as a function of pressing force and plate temperature and spring back occurred in all materials after the tool plates opened. It was deduced that the pattern dimensions of the embossing plate somewhat determined the achievable pattern height in the fibre-based sample materials, but the amount of springback did not change as a function of material thickness. Despite this finding, it was consistent that the amount of spring back was regularly reduced with higher tool temperatures. The optimization study of the magnitude of the forming force showed that excessive use of force is not required, which is beneficial in reducing the risk of material damage during processing and adjustment of embossing devices. All samples differing significantly from each other were found to be suitable for embossing, indicating that patterns such as those tested could be added to a variety of packaging applications.