Abstract

The development of sustainably-sourced adhesives is essential to displace conventional particleboard adhesives made from formaldehyde and other petroleum derivatives. This work evaluates the mechanical properties of particleboards prepared from sugarcane bagasse, spirulina algae powder, soy flour, and sodium hydroxide at various algae to soy ratios and denaturation times. The rheology of the adhesive was characterized using the Hershel-Bulkley method to determine the yield stress (max. 288 Pa) and flow behavior index (0.21–0.54). The lap shear strength (max. 3.02 N/mm2) was also determined. For the particleboard, the secant modulus of elasticity (max. 1.12 GPa), tangent modulus of elasticity (max. 1.30 GPa), modulus of rupture (max. 11.62 N/mm2), and internal bond strength (max. 0.09 N/mm2) were determined. These particleboards met the minimum requirement set by ANSI/A208.1–1999 for general-use particleboards for the modulus of elasticity and modulus of rupture, but they did not meet the standard for internal bond strength.

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