Abstract
This study examines the sustainability of uniform as well as an optimal grounding grid (GG) design for the microgrid (MG), in terms of variations in the top layer (TL), middle layer (ML), and bottom layer (BL) soil resistivities ( ρ 1 , ρ 2 , and ρ 3 , respectively) along with change in a thickness of TL and ML. GG design is highly dependent on ρ 2 , as it helps in determining the density of conductors at grid extremities. With an increase in ρ 2 , touch voltage (TV) crosses its tolerable limit, but step voltage (SV) remains within its limit. However, with a simultaneous increase in the thickness of ML (MLT), SV also crosses its limit. For ρ 2 higher than ρ 3 , with an increase in MLT, TV, and SV increase, while in the reverse case, they decrease. For the given MLT, ρ 3 is crucial in determining GG burial depth. Validation of results is done by comparing them with the IEEE standard. Also, the optimal compression ratio of GG with an increase in MLT is analysed. TVs can be reduced to a great extent, with the application of distinctive methods of earthing (TT-GG system, TN-S-GG system, and TN-C-S-GG system) in MG. This study also reveals that an increase in GG resistance leads to a reduction in TV.
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