Abstract
The substrate (Ni)‐catalyzed electroless gold plating process invented by Iacovangelo and Zarnoch has been investigated for plating gold on electroless nickel substrates for application to bonding of electronic devices. The process was found to yield uniform and adherent gold films on Ni‐B substrates, whereas on Ni‐P substrates acceptable gold films were obtained only when the P content was low and a pretreatment procedure was introduced to prevent the formation of surface oxide or to remove it completely. Unlike the conventional galvanic displacement process, the substrate‐catalyzed process does not attack the nickel substrates and yields gold films with a very low porosity. Compared with autocatalytic electroless gold plating baths, the substrate‐catalyzed bath is inherently more stable, although the maximum gold thickness obtainable is naturally limited. Results of these evaluations are presented in detail. © 2000 The Electrochemical Society. All rights reserved.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
