Abstract
The effects of rigid/non-rigid connectors and stress absorbing elements on mechanical behavior of TISP were studied using 2D finite element analysis. Finite element models were created in DISPLAY III software and were subjected to a static occlusal load of 75N. The use of non-rigid connector increased the stress (17.7 N/mm2) on the implant neck when compared to rigid connector (10.25 N/mm2) and stress absorbing element (8.49N/mm2). Maximum displacement of the TISP (18.74 µm) was seen with a non-rigid connector.
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