Abstract
This report discusses the physical, electrical, mechanical and thermal characteristics of polyimide conductive, resistive, and dielectric thick film compositions made for high‐temperature curing and coating on non‐flexible substrates (alumina). The effects of curing times and print direction on sheet resistivity are presented for conductive patterns. The rates of silver migration of silver loaded resins are examined under 100% relative humidity at 25°C and various gap distances. The effect of current limiting resistors on silver migration is also examined. The electrical characteristics of polyimide thick film (PTF) resistors such as temperature coefficient of resistance and drifts are examined. The relationship of aspect ratio versus mean resistance and sheet resistance, as well as distribution diagrams are presented. The printability and definition of conductor patterns relative to their thickness, separation and the direction of the prints are examined, while the electrical characteristics of crossovers such as voltage breakdown are also investigated.
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