Abstract
The effects of PCB parameters and boundary constraint condition on stress distribution of glass insulator in DC/DC power module are investigated by using finite element analysis. Results show that the constraint condition and thickness of printed circuit board (PCB) have significant effect on the stress of glass insulator compared with the size of PCB. The value of maximum equivalent stress in glass insulator decrease when PCB boundary is constrained. Suitable thickness of PCB would be benefit to alleviate the maximum equivalent stress of glass insulator.
Full Text 
Sign-in/Register to access full text options
Sign-in/Register to access full text options 
Published version (
Free)
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
