Abstract
Hotspot cooling by heat spreader is essential to avoid reliability issues of the electronic device. This paper reports the evaluation of the heat spreading capability of monolayer graphene using a micro-coil heater-thermometer. Monolayer graphene was grown and transferred onto the test structure which consists of Pt/Cu/Ti serpentine micro-coil, pads, and heat sinks. The temperature coefficient of resistance of the bare coil was 0.00876 °C−1. During Joule heating, the bare structure dissipates heat from the coil mainly via stage. Deposited graphene helps carry heat from the coil to the peripheral heat sinks. In transient-state Joule heating, graphene reduced all stage, coil, and hotspot temperature. However, stage temperature cannot be reduced during steady-state Joule heating. The graphene heat spreader reduced the heating rate of the coil from 6.4 °C/W down to 2.8 °C/W. The findings give insight for thermal management strategy on how to reduce the temperature of heat source, heat sinks, and substrate in an actual device.
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