Abstract

Mercaptobenzothiazole (MBT) anticorrosive layer on copper surface prepared in MBT solutions was analyzed by spectroscopic ellipsometry (SE). The results showed that MBT anticorrosive layer was formed on Cu2O layer in the MBT solution at temperatures higher than 50 °C. Additionally, it was confirmed that MBT anticorrosive layer was formed in the MBT solution at room temperature by adding about 20 wt % acetone to the solution. From polishing experiments of MBT anticorrosive layer and benzotriazole (BTA) layer, it was revealed that MBT anticorrosive layer was physically stronger than BTA layer. It is considered that dishing amount in Cu chemical-mechanical polishing (CMP) can be reduced by using MBT. However, MBT anticorrosive layer was not formed in the MBT solution including Hydrogen peroxide (H2O2) suggesting that slurry should be composed without H2O2 in order to use MBT for Cu CMP.

Full Text
Published version (Free)

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call