Evaluation of Cu-Ti dissimilar interface characteristics for wire arc additive manufacturing process

Abstract

PurposeThe purpose of this research is to show the characteristics of a Cu–Ti dissimilar interface produced by a wire arc-based additive manufacturing process. The purpose of this research was to determine the viability of the Cu–Ti interface for the fabrication of functionally graded structures (FGS) using the wire arc additive manufacturing (WAAM) process.Design/methodology/approachThis paper used the WAAM process with variable current vis-à-vis heat input to demonstrate multiple Ti-6Al-4V (Ti64) and C11000 dissimilar fabrications. The hardness and microstructure of the dissimilar interfaces were investigated thoroughly. The formation of Cu–Ti intermetallic at the Ti64/Cu fusion interface is been revealed by scanning electron microscopy and energy dispersive X-ray analysis, while X-ray diffraction was used to identify various Cu–Ti intermetallic phases. The effect of microstructure on interfacial sensitivity and hardness are also investigated.FindingsThe formation of CuTi intermetallic and the β-phase transformation in Ti-6Al-4V are found to be heat input dependent. The Cu diffusion length increases as the heat input for Ti64 deposition increases, resulting in a greater Cu–Ti intermetallic thickness. The Cu–Ti interface properties improve when the heat input is less than approximately 250 J/mm or the deposition current is less than 90 A. The microhardness ranges from 55 to 650 HV from the Cu-side to the interface and from 650 to 350 HV from the interface to the Ti-side. Higher current increases interface hardness, which increases brittleness and makes the interface more prone to interfacial cracking.Originality/valueNonlinear components are needed for a variety of extreme engineering applications, which can be met by FGS with varying microstructure, composition and properties. FGS produced using the WAAM process is a novel concept that requires further investigation. Despite numerous studies on Ti-clad Cu, information on Cu–Ti interface characteristics is lacking. Furthermore, the suitability of the WAAM process for the development of Cu–Ti FGS is unknown. As a result, the goal of this research article is to fill these gaps by providing preliminary information on the feasibility of developing Cu–Ti FGS via the WAAM process.