Abstract
Development of ultrasound transducers for operation in high pressure and high temperature environments is still a challenge. This paper presents an evaluation of different bonding techniques for ultrasound transducers intended for harsh environments. Performance at temperature 180 °C was investigated at atmospheric pressure, and performance under hydrostatic pressure 1000 bar was investigated at temperature 15 °C. Five different bonding configurations were tested, two polymer adhesives and three metallurgical bonding methods. One of the polymer adhesives is a standard epoxy-adhesive, the other is an adhesive intended for operation at high temperatures. Two of the metallurgical bonding configurations studied are Solid-liquid Interdiffusion (SLID) bonds. The third metallurgical bonding method introduces preform soldering as a new bonding technique for ultrasound transducers. All the metallurgical bonding methods outperform polymer adhesives in shear strength and temperature stability. Compared to the SLID-methods, preform-soldering offers a faster and cheaper bonding process without the need for electroplating, making it an attractive metallurgical bonding technique for ultrasound transducers.
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