Abstract

The use of nitrogen trifluoride in the presence of a helium diluent has been investigated in a dielectric plasma‐enhanced chemical vapor deposition (PECVD) chamber cleaning application. Experiments indicated that chamber cleans with equivalent or better clean times and significantly reduced global warming emissions relative to the standard process are possible. One run using reduced the chamber clean time by over 30% while reducing global warming emissions by over 90% relative to a process of record. A tradeoff between high destruction efficiency, which corresponds to low global warming emissions, and short clean times (faster throughput) was observed. A Novellus Concept One 200 dielectric PECVD tool was used in this work. ©1999 The Electrochemical Society

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