Abstract
This article presents a novel cross-rib micro-channel (MC-CR) heat sink to make fluid self-rotate. For a thermal test chip (TTC) with 100 w/cm2, the cross-ribs micro-channel were compared with the rectangular (MC-R) and horizontal rib micro-channel (MC-HR) heat sinks. The results show that, with the cross-rib micro-channel, the junction temperature of the thermal test chip was 336.49 K, and the pressure drop was 22 kPa. Compared with the rectangular and horizontal ribs heat sink, the cross-rib micro-channel had improvements of 28.6% and 14.3% in cooling capability, but the pressure drop increased by 10.7-fold and 5.5-fold, respectively. Then, the effects of the aspect ratio (λ) of micro-channel in different flow rates were studied. It was found that the aspect ratio and cooling performance were non-linear. To reduce the pressure drop, the inclination (α) and spacing (S) of the cross-ribs were optimized. When α = 30°, S = 0.1 mm, and λ = 4, the pressure drop was reduced from 22 kPa to 4.5 kPa. In addition, the heat dissipation performance of the rectangular, staggered fin (MC-SF), staggered rib (MC-SR) and cross-rib micro-channels were analyzed in the condition of the same pressure drop, MC-CR still has superior heat dissipation performance.
Highlights
With the rapid development of integrated circuits in terms of high integration and miniaturization, the thermal design power and heat flux of electronics are increasing
The result shows that double-layered micro-channel heat sinks (DL-MCHS) significantly reduced wall temperature and thermal resistance, as well as pressure drop and pumping power compared with single-layered micro-channel heat sinks (SL-MCHS)
The pressure drop was reduced by optimizing the inclination angle, spacing of the cross-rib, and aspect ratio of the micro-channels, which provided a reference for the optimization of the MC-CR heat sink
Summary
With the rapid development of integrated circuits in terms of high integration and miniaturization, the thermal design power and heat flux of electronics are increasing. Ghani et al [14] studied the fluid flow and heat transfer characteristics (MC-SCRR) of a novel sinusoidal cavity rectangular rib micro-channel heat sink. The result shows that DL-MCHS significantly reduced wall temperature and thermal resistance, as well as pressure drop and pumping power compared with single-layered micro-channel heat sinks (SL-MCHS). Increasing the heat exchange area, reducing convective thermal resistance, and changing the flow state of the fluid can all improve the heat dissipation performance of the micro-channel. The pressure drop was reduced by optimizing the inclination angle, spacing of the cross-rib, and aspect ratio of the micro-channels, which provided a reference for the optimization of the MC-CR heat sink.
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