Evaluating glycine as an alternative lixiviant for copper recovery from waste printed circuit boards

Abstract

Current hydrometallurgical processing routes for copper recovery from waste printed circuit boards (PCBs) utilise strong mineral acids, which pose environmental hazards. Glycine has been proposed as an alternate lixiviant with a lower environmental impact. This study aimed to investigate the effectiveness of glycine as lixiviant for copper dissolution from waste PCBs. Bench scale laboratory leaching tests were performed to investigate the effect of key process variables such as temperature, oxidant type and lixiviant concentration on the rate, extent and selectivity of copper leaching.In the presence of oxygen as oxidant, the glycine concentration did not have a significant effect on the rate or extent of copper leaching in the range 1 M to 2 M. Increasing the temperature from 25 °C to 60 °C increased copper dissolution after 22 h from 29.6% to 81.2% when using a glycine concentration of 1 M. When air instead of oxygen was used as oxidant, the copper dissolution achieved with 1 M glycine after 22 h at 60 °C decreased by 43.9 percentage points to 37.3%, due to the lower concentration of dissolved oxygen in the system. Using hydrogen peroxide instead of oxygen as oxidant, did not improve the overall extent of copper leaching achieved.Leaching with 1 M glycine and oxygen as oxidant at 60 °C is proposed as the most feasible operating conditions within the ranges investigated, because these conditions yielded the highest copper dissolution (81.2%) with relatively low (1.3%) gold co-extraction.