Evaluating Cu Printed Interconnects “Sinterconnects” versus Wire Bonds for Switching Converters

Abstract

This paper demonstrates the feasibility of the printed copper (Cu) paste interconnects for applications in power semiconductor modules and switching converters. Copper sinter paste interconnects denoted as “Sinterconnects” have been recently introduced as an alternative to wire-bonding technology for power electronic device packaging. However, the electrical domain properties of these novel interconnects have not yet been investigated in detail. To address this research opportunity, this paper evaluates the performance of two different types of Sinterconnects applied to multi-chip, insulated gate bipolar transistor (IGBT) power modules. First, parasitic or stray inductances of these Sinterconnected systems are calculated analytically and by using three-dimensional finite element (FE) analysis. In addition to that, resistivity (ρ) of those has been analysed and compared with conventional wire bond technology. Finally, the performances of the Sinterconnects in power device assemblies are experimentally investigated. Two Sinterconnect structures (i.e., printed Cu paste and Cu clip attach) as well as a state-of-the-art wire-bonded IGBT module, have been integrated into a switching DC-DC converter and benchmarked. Experimental measurements show how converters with Sinterconnects enable efficient power conversion.