Etching process of silicon carbide from polysiloxane by chlorine

Abstract

The etching process of silicon carbide by dry chlorine was investigated as a function of etching temperature using a commercial available polymethyl(phenyl)siloxane resin. Results from etching rate show increasing etching temperature could lead to a change for etching mechanism from diffusion-controlling to interface reaction-controlling. The chlorination of β-SiC in this study should be managed at above 600°C and can complete at 900°C for 3h. A pronounced core–shell structure was observed owing to the partial conversion. Silicon carbide derived carbons (SiC-DCs) are in highly microporosity, with single-modal pore size distributions at around 0.9nm.