Abstract

Abstract This study assesses the plasma erosion resistance of Y2O3 and YF3 films deposited on aluminum 6061 substrates by vacuum kinetic spraying, a low-temperature deposition process. Y2O3 and YF3 powders with different particle sizes were selected as feedstock materials and characterized in their as-delivered and heat-treated states. Dense films several micrometers in thickness were sprayed using helium as the process gas and surface component analysis confirmed the successful formation of the yttrium-based layers. Plasma etch rates were measured in nanometers per minute and the results show that there is no significant difference between the two films.

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