Abstract
AbstractA new thermal conduction model is proposed for filled polymer with particles, and predicted values by the new model are compared with experimental data. The model is fundamentally based on a generalization of parallel and series conduction models of composite, and further modified in taking into account that a random dispersion system is isotropic in thermal conduction. The following equation is derived from the new model; log λ = V · C2 · log λ2 + (1 − V) · log(C1 · λ1). Therefore, when thermal conductivities of polymer and particles (λ1, λ2) are known, thermal conductivity of the filled polymer (λ) can be estimated by the equation, with any volume content of particles (V). The new model was proved by experimental data for filled polyethylene, polystyrene and polyamide with graphite, copper, or Al2O3.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
