Abstract

Quasi-vertical GaN barrier Schottky diodes have attracted much attention due to their low cost and high current transfer capability. The main problem is that the reverse characteristics of the devices may not be well estimated, which affects the design of the diodes. In this paper, the defects of GaN materials and the leakage related tunneling mechanisms accompanied with other mechanisms are considered. Based on the established composite device models, the reverse leakage current is simulated which is well consistent with the recent experimental result. With the assistance of the proposed models, several field plate structures are discussed and simulated to obtain a quasi-vertical GaN barrier Schottky diode with high breakdown voltage. The major leakage mechanisms are also analyzed according to the relation among leakage current, temperature and electric field at various reverse voltages. High BFOM up to 73.81 MW/cm<sup>2</sup> is achieved by adopting the proposed stepped field plate structure.

Highlights

  • The main problem is that the reverse characteristics of the devices may not be well estimated

  • which affects the design of the diodes

  • the leakage related tunneling mechanisms accompanied with other mechanisms are considered

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Summary

NT模型 无NT模型

图 1 准垂直 GaN SBD 关键仿真模型 (a) SBT 模型; (b) NT 模型; (c) 准垂直 GaN SBD 的仿真和文献 [9] 提取的反向 J-V 实验 测试曲线比较, 插图给出了仿真的器件结构. 在蓝宝石衬底上先构建掺杂浓 度为 5 × 1018 cm–3 的 1 μm 厚 n+ GaN 层, 然后构 建掺杂浓度为 8 × 1015 cm–3 的 5 μm 厚的 n– GaN 漂移层, 器件长度均为 300 μm, 阳极电极长度为 80 μm, 阴极长度为 40 μm. 在图 2(b) 展示了平面型场板结构, 其中金属 场板设计在 Ni/Al 肖特基阳极和钝化层周围. 而 SiO2/Si3N4 钝化层结合了 Si3N4 的高临界击穿场 强和 SiO2 的高稳定性、高强度的优点 [22,23], 是准垂 直型 GaN SBD 钝化层的一种可行选择. 图 2(c) 给出了接触型场板 GaN SBD 的结构图, 其中金属 场板与钝化层接触, 可以通过与平面型场板结构进 行比较, 可获得金属场板与钝化层的相对位置对器. 为了进一步减小 n– GaN 漂移区边缘的电场集中效应, 本文提出了图 2(d) 所示的阶梯型场板结构, 通过与图 2(b) 所示的平 面型场板结构对比, 来验证阶梯型场板结构对于改 善准垂直 SBD 器件反向电学特性的有效性. 图 3(a) 显示了不同场板结构的准垂直 GaN SBD 的电流密度 J 与反向电压 V 的关系. 然后对阶梯型场板的结构几何参数进行优化, 以改善准垂直 GaN SBD 的反向电学特性. 采用控 制单一变量的方法, 依次改变阶梯型场板的阶梯高 度和宽度, 得到如图 3(b) 的数据结果. 由此可看 出, 当阶梯型场板的阶梯高度和长度分别取 0.1 μm 和 10.0 μm 时, 反向击穿电压 (BV) 达到最大值

Metal FP
Passivation Anode
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