Abstract
This paper describes an error separation method for a precision measurement of the run-out of a microdrill bit by using a measurement system consisting of a concentricity gauge and a laser scan micrometer (LSM). The proposed error separation method can achieve a sub-micrometric measurement accuracy of the run-out of the microdrill bit without the requirement of ultra-precision rotary drive devices. In the measurement, the spindle error motion of the concentricity gauge is firstly measured by using the LSM and a small-diameter artifact, instead of the conventionally used displacement probes and large-diameter artifact, in order to determine the fine position of the concentricity gauge when the spindle error motion is at its minimum. The microdrill bit is rotated at the fine position for the measurement of the run-out, so that the influence of the spindle error motion can thus be reduced, which could not be previously realized by commercial measurement systems. Experiments were carried out to verify the feasibility of the proposed error separation method for the measurement of the run-out of the microdrill bit. The measurement results and the measurement uncertainty confirmed that the proposed method is reliable for the run-out measurement with sub-micrometric accuracy.
Highlights
With the development of high-density printed circuit boards (PCBs) [1,2], there is an increasing demand for the microdrilling of precision holes
An error separation method has been proposed for a precision measurement of the run-out of a microdrill bit by using a measurement system consisting of a concentricity gauge and a laser scan micrometer (LSM)
In order to achieve a precision measurement of the run-out, rotating the microdrill bit at the fine position of the concentricity gauge with the minimum spindle error motion for the measurement of the run-out was proposed for separating the influence of the spindle error motion
Summary
With the development of high-density printed circuit boards (PCBs) [1,2], there is an increasing demand for the microdrilling of precision holes. To satisfy the requirement of high aspect ratio microdrilling on the PCBs, efforts have been devoted to designing and manufacturing microdrill bits with large aspect ratios [9,10,11,12,13,14]. Due to the large aspect ratio and the low rigidity of the microdrill bit, an axial straightness error between the shank part and the body part is very likely to occur, even when manufactured by using ultra-precision grinding tools. For the quality control of both PCBs drilling and microdrill bit processing, it is desired to precisely measure the degree of the run-out of the microdrill bit.
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