Abstract
As thermoelectric coolers (TECs) have become highly integrated in high-heat-flux chips and high-power devices, the parasitic effect between component layers has become increasingly obvious. In this paper, a cyclic correction method for the TEC model is proposed using the equivalent parameters of the proposed simplified model, which were refined from the intrinsic parameters and parasitic thermal conductance. The results show that the simplified model agrees well with the data of a commercial TEC under different heat loads. Furthermore, the temperature difference of the simplified model is closer to the experimental data than the conventional model and the model containing parasitic thermal conductance at large heat loads. The average errors in the temperature difference between the proposed simplified model and the experimental data are no more than 1.6 K, and the error is only 0.13 K when the absorbed heat power Qc is equal to 80% of the maximum achievable absorbed heat power Qmax. The proposed method and model provide a more accurate solution for integrated TECs that are small in size.
Highlights
With the development of semiconductor technology and packaging technology, the thermal management of electronic components has become an important factor restricting miniaturization and integration1
Thermal contact resistance is an important parasitic parameter when thermoelectric elements are short in length, whereas it is usually omitted in both theory and experiment for conventional designs
The results of the containing parasitic thermal conductance Kc model are comparable with the vendor data within the current range of 1.36 A to 3.4 A, and the model does not describe the relationship between the intrinsic parameters and the parasitic thermal conductance
Summary
The proposed simplified model applies the equivalent parameter evaluation method to integrate the intrinsic and parasitic parameters, and the obtained temperature difference is closer to the vendor data. Because the equivalent parameters relate to the Kc and to the current, the result of the proposed simplified model is closer to the vendor data than the conventional model and the model containing Kc, with an average absolute error of 1.6 K. When the thermal load is 0.8 × Qmax, the average absolute error obtained by the simplified model is 0.13 K, and its maximum relative error is within 3% compared with the measured data from the manufacturer. In the case of different heat loads, the simplified model obtained by the proposed cyclic correction method accurately reproduces the performance of a commercial TEC
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