Abstract
In this article, the effect of modified nanosilica (m-nanosilica) on the mechanical and creep performance of epoxy resin were investigated. At the same time, the toughnening mechanisms of epoxy resin with m-nanosilica were also considered. The results show that the crack pinning and crack deflection mechanism contributes only a small part to nanocomposite, this due to the size of the nanosilica particles is such smaller than crack-opening displacement. The FE-SEM surface fracture shows evidence of the debonding of the nanoparticles from the polymer matrix and the expansion of the holes around the nanoparticles as well as the existence of the plastic deformation zone. Plastic deformation and plastic void growth are the main toughening mechanism in nanocomposite material.
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More From: Journal of Science and Technique - Section on Physics and Chemical Engineering
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