Epoxy resin-hydrated halt shaped composite thermal control packaging material for thermal management of electronic components

Abstract

With the rapid increase of the thermal power of electronic devices, phase change material(PCM) have shown great application prospects in the field of electronic thermal management . However, due to the irregular surface of the electronic device, PCM can only act on the back of the component or the outside of the package, which leads to the occurrence of heat transfer hysteresis . In order to reduce the heat transfer distance between the heat source and PCM, a new type of ER/SAT/DSP composite functional material with thermal control function was prepared in this paper to solve the key technical problem of fluid seamless packaging thermal control. The composite material is encapsulated in a fluid state and will no longer melt after solidification. Through thermophysical experiments and morphological characterization, the results show that when the mass fraction of PCM is 35%, the composite material has the best physical properties and application performance. And after 200 thermal cycles, the leakage rate is only 3.7%. Through the PTC thermal control experiment, the results show that the maximum temperature at different positions of the device for pouring the new composite was reduced by 7.4 °C and 8.1 °C, respectively, and the operation time corresponding to different temperatures was increased by 5.76 times, 5.80 times and 6.98 times, respectively. Therefore, the composite material shows a good thermal control ability for electronic components of any surface shape.