Epoxy-matrix composite with low dielectric constant and high thermal conductivity fabricated by HGMs/Al2O3 co-continuous skeleton

Abstract

Electronic packaging materials with low dielectric constant (Dk) and high thermal conductivity (TC) are of vital importance in mitigating signal delay and enhancing heat dissipation efficiency in modern electronics. However, low Dk and high TC are difficult to complement each other, because high TC filler usually possesses a high Dk. Herein, we have newly designed a composite material simultaneously with low Dk and high TC through hollow glass microspheres (HGMs), boron nitride particles, epoxy resin and reticulated porous ceramic (RPC). The composite material prepared by sintering HGMs and RPC is more effective in improving TC while keeping low Dk. Specifically, the Dk of the newly designed composite is lower than 3.0 with a large TC of 0.96 W/m·K. This new epoxy-matrix composite with both low Dk and high TC can shed new light on designing electronic packaging materials for advanced miniaturized electronics.