Abstract
, 1,3-bis(3-aminopropyl) tetramethyl disiloxane (DS) is used as liquid epoxy curing agent of epoxy molding compounds(EMCs) for high-reliability semiconductor devices. Experimental results indicated that DS could be effectively used as epoxy curing agent and greatly lower the viscosity of epoxy system, in which way, the coefficient of thermal expasion(CTE) of EMCs can be lowered effectively by increasing the filler loading. The concentration of DS strongly affected the mechanical properties of the thermally cured epoxy composites. As expected, the flexural modulus of epoxy composite decreased and the toughness was improved.
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