Epoxy Adhesives Modified with Graphene for Thermal Interface Materials

Abstract

Thermal interface materials (TIMs) are extensively used to improve thermal conduction across two mating parts. In this study, the viability of using epoxy resins reinforced with graphene nanoplatelets (GNPs) as TIMs is evaluated. Different GNPs contents are added using a mini-calander to achieve a homogeneous dispersion. The addition of GNPs induces an increase of the glass transition temperature and the storage modulus referenced to the thermosetting matrix. Furthermore, the introduction of high GNPs contents (10 wt%) causes a dramatic increase of the thermal diffusivity (300%) and electrical conductivity (∼10−2 S/m). GNP/epoxy adhesives present enhanced wettability upon aluminum adherends, compared with the strength of joints bonded with neat epoxy adhesives. The introduction of high GNPs contents induces a change of the failure mechanism of joints, from adhesive for neat epoxy resin to cohesive mode.