Abstract
AbstractThe tensile and shear performances of epoxy adhesive were evaluated both experimentally and using molecular dynamics (MD) simulations to understand the shear mechanism operating at the atomic level. A sandwich structure composed of pure epoxy and two copper layers was established based on the standard stretching mode. This three‐layer model was first stretched in the perpendicular direction to examine the dynamic evolution of the epoxy molecules. The epoxy was then adhered onto both smooth and rough copper surfaces to determine their shear strengths. Adhesive failure involving interfacial slippage and slight shear deformation of the epoxy matrix was observed on the smooth copper surface, while the epoxy was strongly bound to the rough surface and fractured under shear stress. MD simulations provided data that are consistent with experimental values. Finally, the shear mechanism was investigated by calculating the interaction energies between the epoxy and copper. This study provides significant insight into the shear‐failure mechanisms of epoxy adhered to copper surfaces.
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