Abstract
The possibility of using xylitol, D-mannitol and D-sorbitol as Cu(II) ligands in electroless copper baths was demonstrated. The ligands mentioned showed good chelating properties for Cu(II) ions in alkaline media (pH > 11.5), i.e. under conditions of the use of traditional formaldehyde-containing solutions. Electroless copper plating solutions containing the chelators xylitol, D-mannitol and D-sorbitol are stable and, under the optimal conditions selected, copper coatings up to 3 μm thick can be obtained in 1 h at ambient temperatures.
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