Abstract

Environmental Stress Screening (ESS) is employed to reduce, if not eliminate, the occurrence of early field failures. In this paper, a three level ESS model is presented for a complex electronic system. Screening is performed at the component, board and system level. Components are screened for a specified duration before being assembled into printed circuit boards (PCBs). Defects introduced during the assembly of the PCBs are screened at the board level, while defects introduced during final assembly are screened at the system level. Components and connections are assumed to come from good and substandard populations and their times-to-failure distributions are modeled by mixed distributions. Mixed exponential distributions are used to model component timesto-failure and mixed Weibull distributions are used to model the times-to failure for board and system level connections. The mixed Weibull distributions are used to model wear-out characteristics at the board and system level. Optimal screen durations in the presence of wear-out are obtained by minimizing the systems life-cycle cost. ESS is shown to be a cost effective strategy when properly implemented. The optimal screening strategies are shown to be relatively robust to the system warranty period.

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