Abstract
The SnBi solder system are argued to be the possible replacement for the lead and hazardous SnPb solder alloy. The features that differs in this study from the other types of Sn58Bi/Cu is the low mass usage of 20g. This low mass serves as to preserve materials and reduce waste. Yet, the main objectives to provide substantial data in term key properties of melting temperature, hardness and contact area properties of this Sn58Bi solder. The melting point of the Sn58Bi solder alloy is 142.25°C, close to the eutectic temperature. The average Vickers hardness value produced by the Sn58Bi was 28.8Hv, considerably high and close to the SnPb. The spreading area of the Sn58Bi solder alloy on the Cu substrate was calculated to 14.85mm2, at the soldering temperature 230°C. These properties are based on 20g of SB that can be predicted to be quite standout, and at the same time provides less waste of materials. Insight discussions are elaborated in this paper.
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