Abstract

Understanding the defect characterization of electronic and mechanical components is a crucial step in diagnosing component lifetime. Technologies for determining reliability, such as thermal modeling, cohesion modeling, statistical distribution, and entropy generation analysis, have been developed widely. Defect analysis based on the irreversibility entropy generation methodology is favorable for electronic and mechanical components because the second law of thermodynamics plays a unique role in the analysis of various damage assessment problems encountered in the engineering field. In recent years, numerical and theoretical studies involving entropy generation methodologies have been carried out to predict and diagnose the lifetime of electronic and mechanical components. This work aimed to review previous defect analysis studies that used entropy generation methodologies for electronic and mechanical components. The methodologies are classified into two categories, namely, damage analysis for electronic devices and defect diagnosis for mechanical components. Entropy generation formulations are also divided into two detailed derivations and are summarized and discussed by combining their applications. This work is expected to clarify the relationship among entropy generation methodologies, and benefit the research and development of reliable engineering components.

Highlights

  • Entropy generation is a physical quantity representing energy loss, and it can quantify energy transmission and judge thermal performance

  • The results showed that the entropy generation of the landing pad is 50% greater than that of the Through-silicon via (TSV) body and indicated that the landing pad is easier to damage than the TSV body

  • An overview is given of the development of methods for the evaluation of irreversible degradation based on the entropy generation

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Summary

Introduction

Entropy generation is a physical quantity representing energy loss, and it can quantify energy transmission and judge thermal performance. Entropy can integrate the thermal-related applications, such as electronic devices, mechanical structures, and heat exchangers. The second law of thermodynamics the years with the goal of ofelectronic predicting diagnosing the reliability of electronic or mechanical serves as an indicator of heat transfer performance. The analysis of entropy generation plays an important role in characterizing the reliability of or mechanical components. Entropy generation methodologies are classified into two categories: damage analysis for this work, entropy generation methodologies are classified into two categories: damage analysis for electronic devices and defect diagnosis for mechanical components. Developed entropy generation electronic devices and defect diagnosis for mechanical components.

Entropy
Entropy Methodologies for Electronic Devices
Entropy Methodologies for Composite Boards
Entropy Methodologies for Electronic Systems
Entropy Methodologies for Defect Diagnosis of Mechanical Components
Research Progress on Defect Diagnosis
Methodologies for Defect Diagnosis
Findings
Conclusions
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