Abstract
With increasing data rates and reduced margin for communication errors both consumer electronic products as well a large-scale digital systems like data centers have to be designed very carefully with respect to their electrical integrity. In this presentation two aspects of this integrity, namely signal and power integrity, will be explained in some detail. The focus will be put mostly on packaging and electromagnetic compatibility (EMC) aspects. Topics that will be addressed include discontinuities, transmission line effects, crosstalk, bypassing and decoupling, via and power plane effects, return current issues, and measurement techniques. The presentation should be suitable for both a technical and a non-technical audience.
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